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Thats why I ripped mine open and installed a bazillion fans to keep it cool. The heart of the RRoD failure is due to the solder being crappy. The EU demanded that MS use lead free solder which is more brittle and prone to crack under pressure. The X-clamp design that MS uses to hold the heat sinks to the board doesn't help either. Combine the two design flaws with the incredible amount of heat that is produced by the GPU and the incredibly small GPU heat sink and you get board warping which ends up cracking the solder connecting the GPU to the board thus resulting in the RRoD. The best thing to do is get something that will help cool your xbox after you get it back from MS.
Good luck (mines been working for over a year with zero hiccups - had to restart it 3 times in a year)
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